You’re responsible to perform process (Wire Bond (ball bond-Al/Cu) development activities including process parameters scouting, optimization, verification and process freeze ect..
Your Role
Key responsibilities in your new role
1. Perform process development activities (process parameters scouting, optimization, verification and process freeze)
2. Establish and setup new assembly process capabilities including hands-on equipment setup
3. Support prototype and development samples build
4. Responsible or support for technical handshake and knowledge transfer to Operations.
5. Drive and liaise with suppliers for continuous improvement and perform verification and qualification activities for new tooling, machines and materials in Development projects
6. Generate and update relevant documents, e.g. Process Specification, PFMEA, OJTI, PDR
7. Be the technical lead for task force and complex problem solving team using statistical and analytical tools, eg SPC, APC, DOE, 8D, FMEA
8. Provide inputs for updating of related documents and is responsible for their correct contents, eg Process of Record, Assembly Design Rule, Failure catalogue, Control Plan, Maintenance checklist
Your Profile
Qualifications and skills to help you succeed
1. Bachelor or Master’s Degree in Mechanical, Electrical or Electronics Engineering, Material Science, Metallurgical Engineering or a related discipline
2. At least 10 years of working experience in semiconductor packaging
3. Prior experience in Map mold, SON, TO, DSO power product development is strongly preferred
4. Strong hands-on knowledge and skills in Wire Bond (ball bond-Al/Cu) process
5. Statistical data analysis, analytical, and problem-solving skills, eg DoE, 8D, DMAIC
6. Good communication, presentation skills & Microsoft office
7. Good aptitude for collaboration, negotiation and solution finding
8. Competent in daily oral & written English for cross-functional and overseas communication
Contact:
[email protected], LinkedIn
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