2 个优质senior director, technical innovation and commercialization职位（正在招聘！）

External Manufacturing NPI Engineer (Assembly Packaging)
onsemi —苏州市
- 全职
Senior Panel Operator
Nouryon —宁波市
- 全职
1天

More jobs to discover

Find similar jobs that you might be interested in.

Senior Panel Operator
Nouryon —宁波市
Ningbo, Zhejiang, China Apply until: 14 Jul 2026 岗位职责： • 遵照SOP以及工厂有关HSE、质量和运作方面的各类规程、政策、规定的要求，协助生产领班带领本岗位班组高效的及时完成日常的生产工作活动和任务； • 对原辅料和产品的数量及质量负责…
1天

我想收到 senior director, technical innovation and commercialization 的最新职位提醒

一旦登录您的账户，即表明您同意 SimplyHired 的服务条款和我们的Cookie 协议及隐私政策。

External Manufacturing NPI Engineer (Assembly Packaging)

onsemi -
苏州市

立即申请

职位详情

全职

完整职位描述

We are looking for a skilled NPI Engineer (Assembly Packaging) to join our External Manufacturing team to drive our growing NPI/ NPD portfolio in China, especially new tactical engagements critical for onsemi's business growth. Key focus will be wafer-level packaging (WLP), bumping and post-foundry solutions. In this role, you will leverage your strong expertise and extensive technical network to drive new production introduction, develop new capability requirements, shape manufacturing strategies, and deliver advanced solutions for next-generation silicon technology and WLP solutions.

Responsibilities

Own backend external manufacturing NPI from conceptualization, development, qualification to production launch with a focus on wafer-level packaging (WLP) and post-fab solutions
Functional Leadership for NPI to deliver PLM requirements for new product commercialization and to co-work with cross functional team (comprising both internal and external stakeholders) to achieve on-time market release
Drive DFM, technology & manufacturability readiness for new product/ package development, effective POR freeze for new product introduction
Partner with OSATs to deliver assembly readiness for new product qualification. Key activities include BOM & process setup, risk analysis & mitigation, process characterization, lookahead assessment, qualification and CAB preparation leading to first part release
Manage production ramp: lead production safe launch, provide technical support to resolve ramp issues, develop CIP, set production baseline for transition into HVM
Collaborate with internal & external partners for technology pathfinding, package roadmap as well as design rules/ guideline development
Adoption of data analytics and data-driven approach to problem solving and decision making
Establish Best Known Methods (BKM) and Best-in-Class practices for new package platform and fan-out to production
Participate in quality and process readiness audit to achieve production site readiness
Co-work with operations to drive continuous yield improvement for evolving challenges
Subject Matter Expert to address arising package and assembly challenges
Experienced candidate(s) will be considered for technical lead role to manage team activities

Qualifications

Bachelor's Degree in Engineering/ Materials Science or equivalent technical background
More than 10 years of experience in backend semiconductor IC manufacturing environment, with in-depth assembly process expertise and shop floor experience
Hands-on experience in wafer-level packaging (WLP), bumping and post-fab solutions including electroless & electrolytic plating and other surface finishing technology
Familiar with plating chemistry/ process and material/ metallurgy characterization & microstructural analysis
Exposure to power device technologies (SiC, JFET, GaN, IGBT, Hybrid etc)
Prior experience in NPI, product/ process integration and familiar with Chip-to-Package Interaction (CPI) effect
Experience in IC package design/ CAD/ FEA simulation/ characterization will be advantageous
Good overall understanding of OSAT business landscape and operations
Adept at cross-functional collaboration, Adaptable to matrix organization, strong engineering fundamentals (including DOE characterization, SPC, failure analysis) and problem-solving skills
Strong project management skills and multi-stakeholder management
Proficient in statistical analysis methods and familiar with data analytics
Good communication skills and proficient in written & spoken English. Spoken proficiency in Mandarin will be advantageous

About Us

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits

About the Team

We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.

立即申请

完善您的搜索

senior director, technical innovation and commercialization 个职位

External Manufacturing NPI Engineer (Assembly Packaging)

Senior Panel Operator

More jobs to discover

我想收到 senior director, technical innovation and commercialization 的最新职位提醒

Related Searches

求职者工具

雇主工具

浏览

保持联系