TE Connectivity’s R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise include: materials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems
BU / FUNCTION DESCRIPTION
Our purpose in Data and Devices is to create a safer, sustainable, productive and connected future across our key markets:
1. Artificial Intelligence (AI)
2. Cloud
3. Enterprise/Telecommunications
4. Tier 3/Business Retail Equipment (BRE)
5. Internet of Things (IoT)
6. In these markets, we are driving growth and innovation with an industry-leading product portfolio, global manufacturing capabilities and the expertise and dedication of each of our employees across all functions.
AI is an emerging trend of a global industry and AI chip volume is growing. The purpose of D&D Socket team is to create a socket platform for:
1. Large size and high speed signaling (224G/448Gbps) for AI GPU, x89 CPU and Switch NPU
2. S mall pitch, High density and high speed signaling (224G/448Gbps) for CPO, CPC and Near Chip
3. And to provide timely, technically differentiated, muti-gen solution through co-architect with our customers
ROLE OBJECTIVE
As a Signal Integrity Engineer in D&D Socket team, you will focus on the electrical design, simulation, and verification-validation testing of the CPU socket and internal connector products - targeting high speed communications and connectivity in datacenters and wireless infrastructure.You will be expected to independently work on projects in the areas of signal integrity for socket product and system design including modeling, simulation, testing and printed circuit board layout. You will work collaboratively within a broader cross functional team of mechanical, manufacturing and operations to execute leading edge products designs. You will manage technical elements for the signal integrity performance of a product/platform beginning with the initial analysis through prototype fabrication, evaluation and production verification testing.
