Sense the power of light
The ams OSRAM Group is a global leader in innovative light and sensor solutions. With more than 110 years of industry experience, we combine engineering excellence and global manufacturing with a passion for cutting-edge innovation enabling transformative advancements in the automotive, industrial, medical, and consumer industries. “Sense the power of light” – our success is based on the deep understanding of the potential of light and distinct portfolio of emitter and sensor technologies. Around 19,700 employees worldwide drive innovations alongside societal megatrends. Find out more about us on https://ams-osram.com
As Business Unit AMSL Automotive Solutions & Lamps we support our vision and strategy by expanding our leading position in the automotive lighting market in OEM and Aftermarket. We are in a global leadership position in the automotive lamps business in traditional and LED applications and offer industry leading products in LED lighting to global OEM customers (e.g. with exchangeable LED light sources). We also tackle new growth opportunities in the Aftermarket with our automotive care and equipment portfolio.
Your new responsibilities
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Lead LED packaging design projects including COB and high-power modules.
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Develop and optimize packaging structures for thermal and optical efficiency.
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Select and validate packaging materials such as substrates, adhesives, and encapsulants.
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Perform thermal, optical, and mechanical simulations to ensure design robustness.
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Collaborate with cross-functional teams for product integration and performance optimization.
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Establish and maintain packaging process standards and documentation.
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Support reliability testing and failure analysis for continuous improvement.
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Drive innovation in packaging technology and participate in patent applications.
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Ensure compliance with industrial and environmental regulations.
Who we are looking for
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Bachelor’s degree or above in Materials Science, Electronics, or related field.
- 8+ years experience in LED packaging or semiconductor packaging.
- Proficiency in thermal and optical simulation tools (ANSYS, LightTools).
- Strong knowledge of packaging materials and reliability standards.
- Excellent project management and cross-functional communication skills.
- Fluent in English and Mandarin for technical communication.
Please contact Ke Li for further information via [email protected] or +86 510 81908308.
