位于上海市, c23的 1 个优质pcb technology engineer职位（正在招聘！）

MGR II R&D/PRODUCT DVL ENGINEERING (ICC SI)
TE Connectivity —上海市

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MGR II R&D/PRODUCT DVL ENGINEERING (ICC SI)
TE Connectivity —上海市
Advanced continuous improvement skillset with demonstrated experience implementing best practices to enhance engineering efficiency.

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MGR II R&D/PRODUCT DVL ENGINEERING (ICC SI)

TE Connectivity -
上海市

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职位详情

完整职位描述

Job Requirements

Manage and lead a team of regional/global signal integrity engineers in establishing signal integrity design performance and functional requirements for new products
Lead the team to perform signal integrity simulations for multiple high-speed standards on each product. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface.
Guide the team in connector design and qualifications from a signal integrity standpoint with a focus on making data driven decisions about the product functionality and areas for improvement.
Create actionable recommendations based upon design reviews and simulation results.
Lead the team in communicating actions and impacts clearly to stakeholders including management, customers, and the technical community.
Align the technology roadmap with the market trends, customer needs, and implement accordingly.
Drive a culture of innovation using a base of traditional approaches and external knowledge to develop innovative solutions.

Effectively lead a regional/global team of SI engineers of varying levels of experience with different backgrounds, experiences, and cultures.
Drive high performance by providing your team routine coaching and feedback, holding your team accountable to meet performance objectives, and providing meaningful development to increase individual/team capability.
Manage employee wellbeing by prioritizing work, effectively managing resource loading, and providing flexibility to enable employees to successfully balance their work and personal lives.

What your background should look like

Bachelor’s degree in Electrical Engineering or equivalent work experience; Master's Degree preferred
Generally requires 13 years of relevant work experience in electrical Design, RF design or PCB design
Generally requires a minimum of 5 years of progressive leadership and people management experience in a global environment
A solid understanding of electromagnetic theory and electrical circuit behavior
Expert with Signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools)
Proficient with 3D CAD tools (SpaceClaim preferred, AutoCAD, Creo, or equivalent)
Proficient with high-speed test equipment (VNA, TDR, BERT)
Proficient with interconnect design or electronic packaging, with a preferred focus on high-speed differential connectors and/or cable assemblies, RF connectors, and channel integration.
Proficient with printed circuit board layout and design (Altium preferred), fabrication and assembly, especially as associated with connector FP and card-edge interfaces
Proficient with data analysis techniques, appreciation for design geometry tolerance impacts, and HVM qualification.
Practiced analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem.
Experience with physical layer communications systems and architectures.
Fluent in English (both verbal and written)
Ability to work in a global environment – able to accommodate varying time zones and capable of collaborating with individuals across geographies.
Master problem solver – able to solve unusually high complexity situations with little to no direction. Pro-active in identifying complex issues, providing solutions, and driving improvements to evolve procedures
Advanced capability in presenting technical solutions to customers and upper management
Demonstrated experience leading/developing a team of 10+ experienced professionals who exercise latitude and independence in their assignments with accountability for team/department performance, project delivery, and resource allocation.
Advanced capability in building and leading a high performing team - experienced in assessing talent fit (current team and future hires), aligning skills to business needs, identifying skillset gaps needed to strengthen the team, identifying organizational gaps creating barriers, and taking the necessary actions to maintain a high-performing team.
Demonstrated experience and accountability for establishing and ensuring adherence to budgets, schedules, and work plans.
Advanced capability in leading cross-functional new product development projects which require strong collaboration and influencing skills to achieve the right outcome for the business.
Advanced capability in driving a data analytics mindset across the team – identifying the most meaningful data to collect, analyzing it, drawing conclusions, and presenting those conclusions as data intelligence to provide insight and drive innovative solutions for the business.
Advanced capability in leading change in a high-paced and dynamic environment with an understanding of common barriers to effectively managing change.
Advanced continuous improvement skillset with demonstrated experience implementing best practices to enhance engineering efficiency.

Competencies

SET : Strategy, Execution, Talent (for managers)

Job Locations:

BUILDING 5, 1F-8F, NO.1528 GUMEI ROAD
SHANGHAI, Shanghai 200233
China

Posting City: SHANGHAI

Job Country: China

Travel Required: 10% to 25%

Requisition ID: 146071

Workplace Type: Onsite

External Careers Page: Engineering & Technology

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在上海市, c23的pcb technology engineer个职位

MGR II R&D/PRODUCT DVL ENGINEERING (ICC SI)

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在上海市, c23的pcb technology engineer个职位

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