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Description
The Apple Thermal Design group has an opening for an experienced Thermal Engineer in Shanghai.
Serve as Apple’s in-region thermal expert by leveraging a detailed understanding of heat pipe, vapor chamber, and module-level thermal designs and validation requirements.
Manage multiple projects in different development phases across various locations.
Collaborate with in-region and US-based Thermal Engineers on technology evaluation, design investigation, and process development for new products.
Establish and manage relationships with thermal suppliers to identify emerging technologies, collaborating to develop new solutions that meet Apple’s product roadmap needs.
Develop and execute thermal tests and experiments at supplier factories to establish solid design guidelines. Complete data reduction and analysis, and prepare comprehensive test reports.
Take a leading role in suggesting or adopting ideas for improving the productivity and quality of thermal components.
Provide in-region expertise for root cause analysis and corrective action regarding defective thermal parts and materials.
Handle multiple tasks and projects in parallel, traveling across different vendor sites as needed.
Preferred Qualifications
Data analysis experience using statistical tools (JMP, Tableau, etc.) is a plus.
Thermal simulation experience using CFD tools (Flotherm, Icepak, etc.) is a plus.
Basic coding skills (Perl, Python, etc.) are a plus.
Minimum Qualifications
BS or MS in Mechanical Engineering or a related field.
Experience working for thermal module companies or factories. Frequent domestic travel is required.
Over 3 years of work experience in thermal module design for consumer electronics or related industries. Must possess fundamental design knowledge of heat pipes or vapor chambers and familiarity with manufacturing processes.
Experience with thermal modules or thermal-related parts (heat pipes, fans, vapor chambers, graphite, etc.), testing design, validation, and test equipment (DAQ, Wind tunnels, IR Cameras, Power Supplies, X-ray, CT-Scans, etc.).
Excellent data analysis skills and independent failure analysis capabilities.
Proficient written and oral English, with strong communication skills for interfacing among design, OEM, and third-party vendor teams.