Headquartered in Lowell, Massachusetts, MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard. MACOM has multiple design centers, Si, GaAs and InP fabrication, manufacturing, assembly and test, and operational facilities throughout North America, Europe, Asia and Australia. In addition, MACOM offers foundry services that represents a key core competency within our business. The foundry provides access to, and control of our broad range of proprietary technologies in an asset light, cost effective structure.
MACOM sells and distributes products globally via a sales channel comprised of a direct field sales force, authorized sales representatives and leading industry distributors. Our sales team is trained across all of our products to give our customers insights into our entire portfolio.
Our global organization of skilled engineers is driven every day to solve the world’s most demanding wireless and wireline application challenges. We’re proud of our more than sixty years’ of hands-on experience designing and building analog semiconductor technology across the RF to Light spectrum.
Senior Manufacturing Engineer - Singulation
Position Overview:
We are seeking a skilled and detail‑oriented Singulation Manufatcuring Engineer with a strong background in scribe and break processes, specifically for Indium Phosphide (InP) wafers and laser devices. The ideal candidate will play a critical role in working with one of our key semiconductor backend manufacturing suppliers, ensuring optimal process performance, yield, capacity, and operational efficiency of our singulation processes.
The role will be based primarily at the supplier site, with a strong expectation of hands‑on engagement on the production floor. In addition to technical process ownership, the engineer will actively support operations execution, including capacity planning, cycle time reduction, and throughput optimization. Experience with III‑V compound semiconductor materials and laser or photonic devices is highly desirable.
Key Responsibilities:
Oversight of the operation, control, and optimization of scribe and break singulation processes for InP wafers and laser devices.
Own singulation operational performance, including capacity, cycle time, throughput, and equipment utilization.
Partner with supplier operations teams to balance line capacity, identify bottlenecks, and support production ramp and demand fluctuations.
Drive cycle time reduction initiatives through process optimization, tooling improvements, and work‑flow efficiency.
Support production planning by providing technical input on singulation capacity limits, constraints, and scaling strategies.
Provide hands‑on process troubleshooting and root cause analysis for singulation‑related defects, including chipping, cracking, low die strength, and yield loss.
Collaborate with design, process, and quality teams to evaluate singulation impact on device performance, yield, and reliability.
Act as the primary on‑site technical interface between the company and the supplier for singulation processes.
Train supplier operators and technicians on proper singulation methods, equipment usage, throughput best practices, and handling protocols.
Ensure the supplier has suitable preventive maintenance schedules in place and executes them effectively to protect uptime and output.
Work with equipment and tooling vendors to support process optimization, throughput improvements, and tool capability enhancements.
Contribute to the resolution of quality, yield, and manufacturing flow issues linked to singulation.
Support engineering builds, new product introduction (NPI), technology transfer, and continuous improvement initiatives.
Drive yield improvement, cost reduction, and productivity improvements related to singulation.
Work with the supplier on KPI tracking, and continuous process improvement activities.
Qualifications:
Bachelor’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, or a related field (or equivalent experience)
5+ years of experience in semiconductor manufacturing with hands‑on singulation process experience.
Strong working knowledge of scribe and break singulation, ideally on InP or other III‑V compound semiconductor wafers.
Understanding of material fracture behavior, wafer handling, die strength, and throughput trade‑offs.
Experience in cleanroom or semiconductor backend manufacturing environments is preferred.
Strong analytical and problem‑solving skills, with the ability to interpret yield, SPC, capacity, and cycle time data.
Skilled in data analysis and visualization tools: Minitab, JMP, Power BI, MS Office suite.
Excellent English communication skills, both written and verbal.
Ability to work effectively in a supplier‑embedded, fast‑paced production environment.
Preferred Experience:
Experience with laser diode, photonic, or optoelectronic devices Familiarity with InP wafer processing and III‑V materials
Knowledge of die strength testing, edge quality inspection, and failure analysis techniques
Experience with singulation inspection tools and optical/SEM analysis
Exposure to high‑volume manufacturing, production ramp, or factory operations roles
Understanding of end‑to‑end manufacturing flow, from wafer fab through assembly and test
Functional Competencies
Deciding and Initiating Action
Makes prompt, clear decisions which may involve tough choices or considered risks.
Takes responsibility for actions, projects and people.
Takes initiative, acts with confidence and works under own direction.
Initiates and generates activity.
Relating and Networking
Establishes good relationships with customers, contractors and staff.
Builds wide and effective networks of contacts inside and outside the organisation.
Relates well to people at all levels.
Manages conflict.
Work remotely.
Analysing
Analyses numerical data, verbal data and all other sources of information.
Probes for further information or greater understanding of a problem.
Makes rational judgments from the available information and analysis.
Produces workable solutions to a range of problems.
Demonstrates an understanding of how one issue may be part of a much larger system.
Personal Characteristics
Innovative individual who is able to influence others whilst having the resilience to pursue issues to a satisfactory conclusion without excessive guidance.
Ability to achieve targets under pressure whilst managing conflicting priorities.
Can demonstrate successfully the use of Problem solving techniques with an excellent attention to detail is essential.
