Key Responsibilities
1. Business Development & IP Sales
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Drive IP licensing growth in China, with a strong focus on Tensilica DSP and CPU technologies.
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Engage with SoC teams in automotive, AR/VR, mobile, smart speakers, TWS, and broader consumer markets.
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Identify and qualify new business opportunities, expand existing accounts, and manage the full sales cycle.
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Understand customer architecture requirements, future roadmaps, and competitive offerings to position Tensilica IP effectively.
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Work closely with China sales teams to develop and execute regional account strategies.
2. Software Partner Ecosystem Management
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Build, develop, and nurture relationships with key software vendors, including:
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AI/ML algorithm developers
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Audio/voice/ANC/beamforming software vendors
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Vision and XR software developers
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Automotive middleware and safety‑related software providers
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Advocate Tensilica DSPs by driving:
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Partner onboarding
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Technical enablement
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Performance optimization
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Joint solution and reference design development
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Expand the breadth of use cases supported on Tensilica DSPs, including:
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AI inferencing
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Audio/voice processing
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Sensor fusion
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XR/AR acceleration
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Always‑on, low‑power workloads
3. Collaboration with China Sales & FAE Teams
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Work hand‑in‑hand with the China sales organization to coordinate account strategies and engagement plans.
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Partner closely with FAE teams to:
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Support technical evaluations
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Manage benchmarking activities
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Drive proof‑of‑concept engagements
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Resolve technical blockers that influence purchasing decisions
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Provide feedback from customers and partners to guide product planning and roadmap decisions.
4. Market Intelligence & Strategic Planning
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Develop China‑specific go‑to‑market strategies for automotive and consumer segments.
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Monitor industry trends, emerging workloads, regulatory standards, and local ecosystem shifts (software and hardware).
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Represent the company at China industry conferences, partner workshops, customer summits, and semiconductor forums.
Qualifications
Required
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Bachelor’s or Master’s in Electrical Engineering, Computer Engineering, or related discipline.
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10+ years of experience in semiconductor IP, DSP/CPU/NPU technologies, SoC design, embedded software, or related business development roles.
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Strong technical understanding of DSP architectures, signal processing, embedded systems, and AI workloads.
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Proven success selling semiconductor IP or building technical business engagements in China.
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Familiarity with software ecosystems in audio, voice, AI/ML, AR/VR, and automotive domains.
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Excellent communication, negotiation, and relationship‑building skills.
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Ability to travel within China and internationally.
Preferred
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Direct experience with Tensilica DSPs or similar configurable DSP architectures.
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Existing relationships with:
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China automotive SoC vendors
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Smartphone/IoT/CE chipmakers
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AR/VR and edge‑AI solution developers
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Leading software algorithm partners
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Understanding of heterogeneous compute architectures, low‑power SoC design, or automotive functional safety (e.g., ISO26262).
