Identify and develop new wire bonding processes for products/packages,establish process controls to ensure high quality and reproducible manufacturing.
Your Role
Key responsibilities in your new role
1.Identify and develop new wire bonding processes for products/packages,establish process controls to ensure high quality and reproducible manufacturing.
2.Perform and guide WB process development: parameter scouting,optimization, verification, and process freeze to meet timeline,quality, cost, and manufacturability targets.
3.Support prototype and development sample builds; conduct technical handshakes and knowledge transfer to production and operation teams.
4.Generate and update process documents: Process Specification,PFMEA/DFMEA, Control Plan, OJTI, Build Sheet, etc.
5.Lead and participate in cross-functional problem-solving teams usingSPC, DOE, 8D, FMEA to resolve yield and quality issues.
6.Develop new WB technologies (e.g., Cu wire, ultra-fine pitch) and improve process capability for new product requirements.
7.Provide technical guidance to junior engineers; contribute IP ideas based on industry research.
8.Liaise with suppliers for continuous improvement; qualify new WBtools, equipment, and materials.
Your Profile
Qualifications and skills to help you succeed
1.Bachelor or Master’s degree in Electrical, Electronics, Materials,Mechanical, Automation, or Semiconductor Engineering.
2.Minimum 5+ years hands-on experience in semiconductor packaging,specializing in wire bonding (Au/Cu wire) process development orhigh-volume manufacturing.
3.Strong knowledge of WB equipment (ASM/K&S/SHINKAWA), processparameters, and failure modes (e.g., stitch crack, wire sweep, bondlift).
4.Proficient in statistical tools: SPC, DOE, Minitab; skilled in rootcause analysis (8D/FMEA).
5.Hands-on lab skills: oscilloscope, bond tester, wire pull/sheartester, optical microscope.
6.Good English communication (written/spoken) for global collaboration.
7.Self-driven, strong analytical skills, team player, and able to driveprojects independently.
Contact:
[email protected], LinkedIn
#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?
We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels.
We look forward to receiving your resume, even if you do not entirely meet all the requirements of the job posting.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
Click here for more information about Diversity & Inclusion at Infineon.
