Technical expert for lead frame / packing material (mold compound,epoxy, solder paste, wires) in package development projects.
Your Role
Key responsibilities in your new role
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Technical expert for lead frame / packing material (mold compound,epoxy, solder paste, wires) in package development projects
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Perform design, drawing and specification for lead frame/ Packing material based on design guideline, assembly rules and ensure design formanufacturing, quality and cost
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Collaborate with internal and material supplier on packing materialdesign, specification and selection; and ensure design formanufacturing, quality and cost
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Drive lead frame / packing material development activities and ensure fulfilment of project milestone deliverables, cost and documentation release (spec, drawing, GIMM, etc)
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Liaise with SQM and supplier to ensure fulfilment of quality requirement / FAI for lead frame/ packing material; and qualification release
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Establish design guideline / requirement for lead frame / packing material specification
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Actively engages with lead frame / packing material suppliers toexplore new technology, best in cost design, etc to achieve competitive advantages
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Generate technical papers / journals and patents related to lead frame / package design that enhances technical value
Your Profile
Qualifications and skills to help you succeed
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Bachelor or Master’s Degree in Mechanical, Electrical or Electronics Engineering, Material Science, Metallurgical Engineering or a related discipline
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At least 5 years of working experience in semiconductor assembly and packaging development and relevance experience in Lead Frame /substrate/ Packing Material is preferred
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Prior experience in DSC, Map mold, SON, TO, DSO power product development is strongly preferred
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Knowledge in material physics / properties for Lead Frame /substrates (DCB/AMB) and packing material (mold compound, epoxy glue,solder paste, WB wires, copper clip)
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Basic knowledge about semiconductor packaging, assembly and test
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Statistical data analysis, analytical and problem solving skills,e.g. 8D, DMAIC
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Good aptitude for communication, collaboration, negotiation and solution finding
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A structured and analytical mindset with a proven ability to drive complex topics independently from analysis to implementation
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Competent in daily oral & written English for cross-functional and overseas communication
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Project management experience is a benefit
Contact:
[email protected], LinkedIn
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