As a Marketing Engineer (RCP Protocol Direction), you will focus on identifying market opportunities and driving product adoption for the Remote Control Protocol (RCP) in the evolution of automotive Electrical/Electronic (E/E) Architectures. RCP is a key technology based on 10BASE-T1S automotive Ethernet, enabling "MCU-less" edge node control and facilitating the automotive industry's transition from distributed ECU architectures to domain controllers, zonal controllers, and ultimately centralized computing platforms — a core technology in the Software-Defined Vehicle (SDV) era.
You will serve as the critical bridge between headquarters and the China market, responsible for translating local OEM and Tier 1 requirements for RCP endpoint chips into product definitions, and leading the market introduction and business growth of new products.
Your role
Key responsibilities in your new role
1.Market Demand Insight & Product Definition
1.1 Endpoint Chip Requirements Collection & Analysis
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Deeply track the technical requirements of mainstream Chinese OEMs (e.g., NIO, Li Auto, XPeng, Changan, Geely, SAIC) and Tier 1 suppliers for RCP endpoint chips in Zonal architectures, including peripheral interface configurations such as GPIO, SPI, UART, I2C, I2S, PDM, PWM, and LIN.
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Collect and analyze customer requirements regarding real-time performance, functional safety (ASIL levels), cybersecurity (ISO/SAE 21434), and PLCA coordinator redundancy for RCP chips.
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Research competitor’s dynamics and product roadmaps of OPEN Alliance TC18 members and compile competitive intelligence reports.
1.2 Product Requirements Document (PRD) Translation
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Systematically organize collected market requirements into Product Requirements Documents, clearly defining chip specifications, interface definitions, software stack requirements, and supporting toolchain needs.
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Conduct regular requirements review meetings with product line managers and R&D teams to ensure the China market voice is fully considered during the product definition phase.
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Track the evolution of OPEN Alliance TC18 and IEEE 1722 standards to anticipate the impact of standard changes on product planning.
1.3 Technical Feasibility Assessment
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Assist in evaluating the technical feasibility and cost advantages of RCP chips in specific application scenarios (intelligent lighting, door control, seat adjustment, audio networks, sensor interfaces, etc.).
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Quantify the value proposition of RCP solutions compared to traditional "MCU + Gateway" architectures in terms of BOM cost savings
2. Market Strategy Development
2.1 China Market Entry Strategy
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Develop differentiated China market positioning strategies based on the functional characteristics of newly developed RCP chips
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Identify and prioritize high-potential application scenarios e.g. intelligent lighting, door/seat control, audio networks and sensor fusion etc., and develop phased market penetration plans.
2.2 Pricing & Value-Based Selling Strategy
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Defined G2M pricing strategy, highlighting the long-term value of RCP solutions in hardware simplification, software development cost reduction, and OTA upgrade convenience.
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Develop flexible pricing and commercial strategies tailored to different customer types (leading OEMs, emerging EV startups, traditional Tier 1 suppliers).
2.3 Ecosystem Partnership Strategy
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Drive partnerships with local software stack providers and AUTOSAR basic software suppliers to enhance RCP ecosystem compatibility.
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Participate in technical exchanges within industry standards organizations (e.g., OPEN Alliance, CCSA) to elevate the company's technical influence in the RCP domain.
3. Business Growth Driving
3.1 Sales Enablement & Channel Management
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Provide systematic product training to internal sales teams and external channel partners (distributors, DFAE teams) to ensure thorough understanding of RCP technical principles, application scenarios, and competitive advantages.
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Develop sales toolkits, including product introduction, application notes, demo solutions, competitive comparison tables, and typical customer case studies.
3.2 Design Win Driving
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Collaborate with sales teams to strategically target zonal architecture projects at leading OEMs and Tier-1s, supporting customer selection evaluations and POC validations from a technical perspective.
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Track customer project progress, coordinate Product Line TM resources to resolve technical issues during the design-in phase, and ensure Design Win conversion rates.
3.3 Business Growth Monitoring & Review
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Establish a business dashboard for the RCP product line in the China market, monitoring Design Win counts, sample shipments, production milestones, and revenue contribution.
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Regularly output market review reports, analyzing business growth drivers and barriers, and dynamically adjusting market strategies.
Your profile
Qualifications and skills to help you succeed
Educational Background:
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Required: Bachelor's degree or above in Electronic Engineering, Microelectronics, Communication Engineering, Automotive Engineering, or related fields.
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Preferred: Master's degree, or MBA/business management background related to the automotive electronics or semiconductor industry.
Technical Competencies:
Required
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In-depth understanding of automotive E/E architecture evolution trends, familiar with the technical characteristics of distributed architectures, domain-centralized architectures, and zonal architectures.
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Familiar with in-vehicle communication protocols (CAN/CAN-FD, LIN, Ethernet, 10BASE-T1S, SOME/IP, TSN, etc.), with a basic understanding of the RCP protocol and OPEN Alliance TC18 standards.
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Understanding of basic concepts of automotive functional safety (ISO 26262) and cybersecurity (ISO/SAE 21434).
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Foundational knowledge of semiconductor products (MCU, PHY, SoC, etc.), capable of reading datasheets and reference designs.
Preferred:
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3-5 years of relevant experience in automotive electronics or the semiconductor industry, with backgrounds in marketing/product management/application engineering preferred.
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Hands-on project experience with AUTOSAR, functional safety, or Ethernet protocol stacks.
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Understanding of local Chinese OEMs' electronic architecture planning and supply chain systems.
Language Requirements:
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Required: Chinese (native proficiency), English (business proficiency, capable of reading technical documents, email communication, and conference calls).
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Preferred: Second language capabilities such as German.
Additional Requirements:
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Willingness to travel frequently, covering major automotive electronics industry clusters in East China, South China, and North China.
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Strong interest in automotive intelligence and Software-Defined Vehicle (SDV) trends, with a commitment to continuous learning.
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Ability to build and manage relationships within all levels of region SMD and BL organization, be interface to key customers and partners at senior management level of commercial functions
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Resourceful, creative, diligent, and able to follow up and make things happen with colleagues and co-workers across many disciplines. Must be a problem solver and competent in co-designing technical solutions.
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