What You Will Do
You will design, simulate, optimize, measure, and correlate high-speed connectors (board-to-board, wire-to-board, cable, and FPC connectors). This role combines strong EM fundamentals, 3D EM HFSS simulations, and lab validation to independently complete the full development loop: model simulate measure correlate
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You will prepare clear technical reports/presentations for both technical and non-technical audiences.
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You will attend customer technical meetings in China to explain SI risks/trade-offs and propose practical solutions; travel is expected (mostly within China, occasional global).
Who You Are (Basic Qualifications)
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Native-level Chinese (Mandarin) and business-level English (spoken/written) for global technical collaboration and customer engagement.
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Strong, practical knowledge of electromagnetics, microwave theory, and transmission line fundamentals, especially for passive structures.
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Deep understanding of SI issues in both time and frequency domains (reflections, resonance, coupling, loss mechanisms).
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Advanced proficiency in ANSYS HFSS, including model setup, simplification, ports, meshing strategy, boundary conditions, convergence, and results interpretation.
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Ability to create accurate models of real hardware and clearly justify modeling assumptions (accuracy vs. complexity vs. runtime).
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Extensive hands-on experience with VNA, TDR, and high-speed oscilloscopes.
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Strong ability to correlate simulations to measurements and troubleshoot discrepancies (fixtures, launches, calibration/de-embedding).
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Comfortable operating in a fast-paced, multi-project global environment and eager to learn new tools and concepts.
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Ability to communicate complex results clearly to both expert and non-expert audiences.
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Demonstrated experience in RF/microwave or signal integrity engineering for passive device design.
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Background in electrical engineering, electronics, or a related field, or equivalent practical experience.
What Will Put You Ahead
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Experience with board-to-board, wire-to-board, and FPC connectors.
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Awareness of mechanical feasibility, tolerances, constraints, manufacturing trade-offs, and geometry exchange/cleanup.
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Experience with SI + mechanical and/or thermal co-simulation for holistic connector design.
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Knowledge of PCIe, Ethernet, USB, and SerDes/channel margin (eye/BER) concepts.
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Use of AI tools to streamline engineering and reporting workflows (e.g., report automation, modeling templates, presentation generation).
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Python scripting for simulation or measurement automation.
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Understanding of PI fundamentals (PDN impedance, return paths, decap strategy) and exposure to PI tools.
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10+ years of experience in RF/microwave or SI engineering for passive devices.
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Master's or PhD focused on electromagnetics or microwave theory, with research emphasis in those areas.
