Take charge of full-lifecycle maintenance for WB wire bonder equipment such as ASM, K&S and Shinkawa, and boost equipment OEE and MTBA
Your Role
Key responsibilities in your new role
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Take charge of full-lifecycle maintenance for WB wire bonder equipment such as ASM, K&S and Shinkawa, and boost equipment OEE and MTBA.
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Preventive Maintenance & Equipment Reliability Management.Formulate and optimize monthly, quarterly and annual PM schedules, checklists and EFMEA documents.
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Yield & Defect Loss Improvement Projects.Adopt SPC, DOE and 5-Why root cause analysis to analyze equipment fluctuations. Resolve recurring equipment-induced defects including broken wires, lifted balls and other similar issues.
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Cost Reduction & Production Capacity Improvement.Verify qualified alternative consumables to cut down equipment maintenance costs.
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Documentation & Quality System Compliance.Draft and revise equipment SOPs, maintenance manuals, troubleshooting guides, calibration standards and equipment history files. Manage EFMEA, control plans and maintenance records to satisfy IATF16949 automotive-grade audit standards.
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Provide training for junior equipment engineers and technicians covering WB equipment mechanical structure, disassembly, calibration and fault trouble shooting.
Your Profile
Qualifications and skills to help you succeed
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Education & Major.Bachelor’s degree or above, majoring in Mechanical Engineering, Automation, Electrical Engineering, Mechatronics, Microelectronics or Precision Instrumentation.
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5 years of professional working experience in WB wire bonder equipment within the semiconductor packaging industry, candidates with power semiconductor manufacturing experience are given priority.
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Proficiency in operating at least one mainstream wire bonder platform (ASM, K&S or Shinkawa). Possess profound expertise in servo motion systems, ultrasonic bonding systems, vision alignment systems, heating stages and wire feeding mechanisms; able to independently complete disassembly, calibration and core component repair work.
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Well-versed in common equipment failure modes of gold wire, copper wire and aluminum wedge bonding processes.
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Tool & System Capabilities.Adept at applying analysis tools including 8D, FMEA, SPC, DOE, fishbone diagram and root cause analysis. Able to conduct data analysis with Minitab or JMP; basic knowledge of PLC and servo parameters is a plus.
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Language & Soft Skills.Fluent written and reading English, basic oral English for technical communication is preferred.
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Excellent hands-on skills for precision equipment maintenance on production lines. Clear logical thinking to quickly locate equipment faults; capable of independently promoting improvement projects and communicating cross-functionally. Be available for on-call emergency support and shift work as required. Capable of mentoring junior team members.
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Preferred Qualifications.Hands-on experience in WB equipment vibration testing or FEA simulation; experience participating in NPI machine launch or equipment automation renovation projects; holding a Six Sigma Green Belt certificate.
Contact:
[email protected], LinkedIn
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