Sense the power of light
The ams OSRAM Group is a global leader in innovative light and sensor solutions. With more than 110 years of industry experience, we combine engineering excellence and global manufacturing with a passion for cutting-edge innovation enabling transformative advancements in the automotive, industrial, medical, and consumer industries. “Sense the power of light” – our success is based on the deep understanding of the potential of light and distinct portfolio of emitter and sensor technologies. Around 19,700 employees worldwide drive innovations alongside societal megatrends. Find out more about us on https://ams-osram.com
The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.
Your new responsibilities
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Lead package design and process integration; lead design & DFMEA reviews with the global team.
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Generate and maintain building block knowledge and drive sharing across teams; lead Building Block development for X-projects on existing platforms.
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Ensure synergies (standardize & minimize number of qualified materials) for new product/package platforms; oversee platform fitness and development; lead platform technical risk assessments.
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Enable and support Dt-X (Design to Cost / Test / Manufacturability).
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Define Building Block design rules and conduct regular alignment with site PDIs (Process Development Integration).
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Initiate necessary projects for performance improvement on existing product/package platforms (post-Q5); develop derivatives or enhance platforms (e.g., testing new materials).
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Provide consultation and technical support to operations on design-related issues and customer complaints.
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Perform other tasks assigned by the Supervisor.
What we look for
Education: Bachelor's or Master's degree in Electrical/Electronic/Mechanical Engineering, Semiconductor field, or equivalent.- Experience: Bachelor’s degree with >8 years, or Master’s degree with >3 years of working experience in LED processes such as die bonding, wire bonding, casting/molding, Trim & Form, and sawing.
- Technical Skills: Experienced in package design, process integration, simulation, and project management. Familiarity with DFMEA, DFSS, QFD, and Six Sigma is preferred.
- Language & Tools: CET-4 minimum; CET-6 preferred. Proficiency in Solidworks.
- Software Skills: Proficient in using different versions of MS Office software.
- Soft Skills: Ability to work under pressure and adapt to rapid changes; a strong team player.
Please contact Jingjing Hu for further information via [email protected] or +86 (510) 81908303.
