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Description
As the PCBA DFM Manager, you will lead a talented engineering group responsible for ensuring our cutting-edge designs translate into manufacturable, high-quality, and cost-effective products. Early invloved in the product development cycle, orchestrating comprehensive DFM reviews and providing actionable design feedback to cross-functional engineering teams; Devleoping robust manufacturing process/ stations during NPI and enasure smooth ramp , stable in sustaining. ","responsibilities":"Engineering Leadership: Directing factory engineering build readiness, coordinating resource allocation, and providing critical on-site support during key development and ramp phases.
Design Validation: Partnering with internal and external stakeholders to design, validate, and deploy complex DFM solutions that meet Apple's stringent quality standards.
Risk Management: Proactively identifying, tracking, and mitigating mass production risks during the development stages to ensure a seamless transition to high-volume manufacturing.
Innovation & Strategy: Championing the evolution of our CM partners toward SMART manufacturing operations, heavily focusing on advanced automation, data analytics, and digital transformation.
Partner Management: Working closely with global cross-functional teams to actively monitor, manage, and elevate the performance of our contract manufacturers and suppliers.
Preferred Qualifications
MS or PhD in Engineering, Materials Science, Semiconductor Packaging, or a related technical field.
Consistent history of successfully delivering large-scale, complex technical projects from concept to high-volume manufacturing.
Exceptional communication, negotiation, and relationship-building skills, with the ability to influence and collaborate effectively across global, cross-functional teams.
Strong strategic capability to drive contract manufacturing (CM) performance and evaluate supplier capabilities.
Experienced with or lead develope and deployement of automations and digital transformation in mass productions
Minimum Qualifications
BS in Engineering, Materials Science, Semiconductor Packaging, or a related technical field.
10+ years of hands-on experience in SMT or semiconductor or system in packaging industries.
Including 5+ years in management role, actively engaing with cross functional teams. With a proven track record of building, mentoring, and inspiring high-performing engineering teams.
Fluent communcation with vebal,wrting and presentation in English.
Self-starter mindset, attention to detail.
