Senior COB / Camera Module Process Engineer – China
Location: China, preferably Shenzhen / Guangzhou area
Company: Shenzhen Sheba Microsystems Co., Ltd.
Function: Engineering / Manufacturing / Camera Module Integration
Reports to: Engineering / Operations Leadership
About Shenzhen Sheba Microsystems Co., Ltd.
Shenzhen Sheba Microsystems Co., Ltd. is developing MEMS-based actuator technology for advanced camera systems used in automotive, robotics, consumer cameras, and embedded vision applications.
As Shenzhen Sheba Microsystems Co., Ltd. moves from engineering samples and validation builds toward mass production, we are strengthening our China operations to support camera module integration, COB assembly, customer builds, supplier coordination, and manufacturing scale-up.
Position Summary
We are looking for a hands-on Senior COB / Camera Module Process Engineer in China to support Shenzhen Sheba Microsystems Co., Ltd.’s camera module development and manufacturing scale-up activities.
This role will support COB sensor assembly, wire bonding, sensor package integration, module build processes, failure analysis, process troubleshooting, and production readiness with our suppliers, camera module makers, and manufacturing partners in China.
The ideal candidate has direct experience with camera module manufacturing, COB packaging, image sensor assembly, wire bonding, active alignment, reliability testing, and NPI-to-MP transition.
Key Responsibilities
1. COB and Camera Module Process Support
· Support COB assembly processes for image sensors and MEMS-based camera modules.
· Work with suppliers and manufacturing partners on sensor attachment, wire bonding, adhesive processes, cleaning, curing, and module assembly.
· Review and support process flows, work instructions, process parameters, fixtures, and inspection criteria.
· Help identify process risks related to particles, wire bonding, sensor tilt, contamination, adhesive overflow, and mechanical interference.
2. Wire Bonding and Sensor Package Support
· Support wire bonding process development and optimization.
· Review wire loop height, wire length, wire clearance, bonding quality, and potential interference risks.
· Work with suppliers to investigate wire-related failures during reliability testing, vibration, drop, or shock.
· Support design-for-manufacturing feedback for sensor package and module drawings.
3. NPI and Mass Production Readiness
· Support EVT, DVT, PVT, pilot builds, and mass production readiness activities.
· Track process readiness, equipment readiness, fixture readiness, and supplier action items.
· Support process transfer from engineering builds to stable manufacturing flow.
· Work with cross-functional teams to close process issues before mass production.
4. Failure Analysis and Problem Solving
· Support failure analysis for camera module defects, including no image, abnormal current, I2C issues, wire shorting, particles, poor MTF, and reliability failures.
· Coordinate X-ray inspection, microscope inspection, cross-section analysis, electrical testing, and sensor-level analysis with suppliers.
· Help identify root cause and corrective actions.
· Prepare clear technical summaries and follow-up actions.
5. Supplier and Customer Technical Support
· Work closely with camera module makers, PCB suppliers, assembly partners, and test houses in China.
· Support technical communication between internal teams and external partners.
· Attend supplier and customer technical meetings when needed.
· Follow up on engineering action items and ensure timely closure.
6. Quality and Reliability Support
· Support reliability testing, including drop, vibration, thermal cycling, high temperature, humidity, and other customer-required tests.
· Review test failures and help determine whether the root cause is design, process, material, fixture, or test-method related.
· Support quality documentation, process control, inspection criteria, and corrective action tracking.
Required Qualifications
· Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Materials Engineering, Microelectronics, Manufacturing Engineering, or a related field.
· 3+ years of experience in camera module manufacturing, COB packaging, semiconductor packaging, image sensor assembly, or precision electronics manufacturing.
· Hands-on experience with COB processes, wire bonding, adhesive dispensing, sensor assembly, or camera module integration.
· Good understanding of camera module manufacturing processes and common failure modes.
· Ability to work directly with suppliers and manufacturing partners in China.
· Strong problem-solving skills and attention to detail.
· Fluent Chinese communication skills.
· English communication skills are required, including the ability to communicate with international engineering, quality, and operations teams.
Preferred Qualifications
· Experience with automotive camera modules, ADAS cameras, robotics cameras, or consumer camera modules.
· Experience with image sensors, MEMS devices, sensor-shift actuators, or optical modules.
· Experience with active alignment, MTF testing, focus testing, reliability testing, and optical inspection.
· Familiarity with NPI, DVT, PVT, PPAP, APQP, 8D, FMEA, and control plans.
· Experience working with international engineering teams.
· Experience in a startup or fast-moving technology environment.
Key Skills
· COB process engineering
· Camera module manufacturing
· Wire bonding process support
· Sensor package integration
· Failure analysis
· Supplier technical support
· Reliability testing support
· NPI and mass production readiness
· Process troubleshooting
· Cross-functional communication
Candidate Profile
The ideal candidate is hands-on, practical, and detail-oriented. This person should be comfortable working directly on the production line with suppliers and camera module makers, identifying process issues, driving corrective actions, and supporting the company’s transition from prototype builds to customer delivery and mass production readiness.
This is a critical role for Shenzhen Sheba Microsystems Co., Ltd.’s China operations as the company scales its MEMS-based camera actuator technology into customer programs and mass production.
How to Apply
Please send your English and/or Chinese CV, together with a brief description of your experience to the following email: [email protected]
Position Senior COB / Camera Module Process Engineer 工作地点: 深圳公司: 深圳示巴微系统有限公司
Job Type: Full-time
Work Location: Hybrid remote in 深圳市
